SHINKAWA Ltd.

SHINKAWA Ltd. company was founded in 1959 and is headquartered in Tokyo, Japan. Shinkawa Ltd. engages in the research, development, design, manufacture, sale, and after-sales service of semiconductor manufacturing equipment in Japan and internationally. Its products include wire bonders, die bonders, COF bonders, bump bonders, flip chip bonders, discrete assemblers, and package sorters.
Contact Details
Office Address
SHINKAWA Ltd.
2-51-1 Inadaira
Musashimurayama-shi, Tokyo, Japan 208-8585
Phone: +81-42-560-0988
Fax: +81-42-560-0844
Executives
President, CEO, and Director
Kouichi Uehara
COO and Director
Sadashi Iida