SHINKAWA Ltd.

SHINKAWA Ltd.

SHINKAWA Ltd. company was founded in 1959 and is headquartered in Tokyo, Japan. Shinkawa Ltd. engages in the research, development, design, manufacture, sale, and after-sales service of semiconductor manufacturing equipment in Japan and internationally. Its products include wire bonders, die bonders, COF bonders, bump bonders, flip chip bonders, discrete assemblers, and package sorters.

Contact Details

Office Address

SHINKAWA Ltd.
2-51-1 Inadaira
Musashimurayama-shi, Tokyo, Japan 208-8585
Phone: +81-42-560-0988
Fax: +81-42-560-0844

Executives

President, CEO, and Director

Kouichi Uehara

COO and Director

Sadashi Iida

Business Reviews for SHINKAWA Ltd.

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