Paradigm Works provides technical consulting services to help semiconductor companies and other parties design new application-specific integrated circuit (ASIC) and field-programmable gate array (FPGA) devices for use in CPU, LAN, SOC, analog, testing, storage, graphics, and telecommunications applications. The company also offers semiconductor intellectual property (IP) cores, chip-design elements that can be added piecemeal and integrated into a new device, protocol verification, chip construction, and foundry support. Branded software products include SystemVerilog FrameWorks (released in 2009), ReleaseWorks, and RegWorks Spec2Reg. Employee-owned Paradigm was founded in 2000 and has offices in the US.

II-VI Incorporated develops, manufactures, and markets materials and derivative precision components and products for precision use in industrial, medical, military, and aerospace applications worldwide. It offers a line of precision infrared optical components, such as lenses, output couplers, windows, and mirrors for use in CO2 lasers; and laser-related products for solid-state lasers and precision optical elements used to focus and direct laser beams onto target work surfaces. The company also provides military infrared optical products and assemblies, including optics for targeting and navigation systems; Selenium and tellurium metals and chemicals that are used as additive materials for metallurgical, glass and animal feed applications, and are used for photovoltaic, electronic, and other industrial applications; thermo-electric coolers, thermo-electric systems, power generation modules, and power generation systems, which provide temperature control; and silicon carbide substrates used in solid-state lighting, wireless infrastructure, radio frequency electronics, and power switching industries. II-VI Incorporated sells its products to original equipment manufactures, system integrators, laser end users, and military and aerospace customers through its direct sales force, as well as through distributors and agents. The company was founded in 1971 and is headquartered in Saxonburg, Pennsylvania.

C&D Technologies, Inc., together with its subsidiaries, engages in the manufacture, marketing, and distribution of electrical power storage systems for the standby power market in the United States and internationally. It offers integrated reserve power systems for the standby power market, which includes telecommunications, uninterruptible power supply, military, cable, utilities, nuclear power plant, pipeline, oil and gas, and other process industries. The integrated reserve power systems monitor and regulate electric power flow and provide backup power in the event of a primary power loss or interruption. The company also produces the individual components of these systems comprising reserve batteries, power rectifiers, system monitors, power boards, and chargers for use in various applications, such as wireless and wireline telephone infrastructure, cable television signal powering, corporate data center network backup, and power for utility switching stations. C&D Technologies, Inc. sells its products to the original equipment manufacturers, broadband and telecommunications providers, and large investor owned utilities, as well as end user customers across various industries, including, banking, retail, healthcare, and manufacturing.

S&I Electronics sighs with pleasure when consumers decide to upgrade their electronic equipment. The company distributes a wide variety of consumer electronics, including DVD players, camcorders, stereo and personal audio systems, as well as televisions of all sorts (including plasma, LCD, projection models, and old-fashioned CRTs). S&I Electronics also distributes household appliances such as ovens, vacuum cleaners, and hair dryers. Serving customers worldwide, the company supplies top brands including Sony, Panasonic, Siemens, and Samsung.

FlipChip International, LLC provides merchant wafer level packaging and flip chip bumping services to the semiconductor industry. Its wafer level services include standard flip chip (SFC), redistributed SFC, Wafer UltraCSP, e-less nickel bumping WLCSP, Polymer Collar, and high frequency RF packaging; and die level services comprise dicing, optical inspection, pick-and-place, waffle-pak, tape and reel, wafer sawing, wafer probe, wafer sort, test, die trays, and ship direct of finished die to end customer. The company also performs services in various categories, which include product qualification, reliability testing, failure analysis, material characterization, and technical/expert reports. FlipChip International, LLC has strategic partnership with Semiconductor Manufacturing International Corporation. The company was incorporated in 2004 and is headquartered in Phoenix, Arizona. As of February 10, 2004, FlipChip International, LLC operates as a subsidiary of RoseStreet Labs LLC.

Tessera Technologies, Inc. was founded in 1990 and is headquartered in San Jose, California. Tessera Technologies, Inc. (Tessera) develops and delivers miniaturization solutions that transform wireless, computing and consumer electronic products. Its micro-electronics solutions enable smaller electronic devices and include semiconductor packaging technologies encompassing interconnect and substrates. Its imaging and optics solutions provide camera functionality in electronic products and include image sensor packaging, wafer-level optics and wafer-level camera technologies, and image enhancement technologies. Tessera also offers micro-optic lenses, from diffractive and refractive optical elements to integrated micro-optical subassemblies. The Company operates in two segments: Intellectual Property, and Product and Service. In February 2008, the Company completed its acquisition of FotoNation, Inc. (FotoNation), a provider of embedded imaging solutions for digital still camera and mobile phone applications.

Stretch, Inc. was founded in 2002 and is based in Sunnyvale, California with additional offices in Tokyo, Japan; and Krefeld, Germany. Stretch, Inc., a fabless semiconductor company, designs, develops, and supplies software configurable processors and development tools for compute-intensive applications. Its products include channel DVR add-in cards; channel capture cards; and DVR capture cards that provide video and audio capture, real-time display, and hardware compression features for DVR designers. The company also offers Stretch IDE, which provides an intuitive development flow, and focuses on programming and system configuration, as well as integrates compiler, debugger, assembler, profiler, linker, and editor tools under an intuitive graphical interface; Stretch reference design kits that are designed for the customers to evaluate a reference design and start the preliminary design of their own products; and Intelligent Encoder software development kit, a video processing and compression solution, which is optimized for the Stretch family of software configurable processors. Its products are used in security and surveillance, broadcast video, wireless communication, and industrial imaging applications.

BE Semiconductor Industries N.V. was founded in 1995. BE Semiconductor Industries N.V., through its subsidiaries, engages in the design, manufacture, marketing and servicing of assembly equipment for the semiconductor industry. The company manufactures semiconductor die sorting, flip chip and multi-chip die bonding, packaging and plating equipment, for both array connect and leadframe assembly processes. The company’s equipment and integrated systems are used to produce semiconductor assemblies or ‘packages’, which provide the electronic interface and physical connection between the chip and other electronic components and protect the chip from the external environment. The company’s products are used to assemble chips for various end-use applications including electronics, computer, automotive, industrial, RFID (Radio Frequency Identification Device) and solar energy. Product groups Die bonding equipment: It includes single, multi-chip and flip chip die bonding systems which place the chip onto a multi-layer substrate; and Die sorting systems, which are used to inspect, select and sort bare dies, flip chips, wafer level chip scale packages and opto-electronic devices for further processing in assembly operations. Packaging equipment: It consists of molding systems that encapsulate bonded semiconductor devices in epoxy resin; Trim and form systems used to cut and then form metallic leads of encapsulated semiconductor devices in leadframe applications; and Singulation systems used to cut packaged array connect devices. Plating equipment: It consists of automated tin plating and spot plating systems for conventional leadframe applications; and antenna plating systems for new RFID and thin film solar cell applications.

Laser Technology, Inc. (LTI) makes laser-based speed and distance measuring systems, most notably the hand held speed guns used by police to nab lead-footed drivers. The company also makes survey and mapping systems that can be integrated with software for record keeping and data analysis. Other products include docking aids (to measure distance and speed) used on ships and NASA space shuttles, and recreational rangefinders.

Micron Technology, Inc. company was founded in 1978 and is headquartered in Boise, Idaho. Micron Technology, Inc., together with its subsidiaries, engages in the manufacture and marketing of semiconductor devices worldwide. Its products include dynamic random access memory (DRAM) products that provide data storage and retrieval, which include DDR, DDR2, DDR3, and other specialty DRAM memory products, such as SDRAM, mobile DRAM, pseudo-static RAM, and reduced latency DRAM. The company also offers NAND flash memory products, which are electrically re-writeable and non-volatile semiconductor devices that retain content when power is turned off. Micron Technology’s products are used in a range of electronic applications, including personal computers, workstations, network servers, mobile phones, flash memory cards, USB storage devices, digital still cameras, MP3/4 players, and in automotive applications. It sells its products to original equipment manufacturers and retailers through internal sales force, independent sales representatives, and distributors, as well as Web-based customer direct sales channel. Micron Technology, Inc. has joint ventures with Intel Corporation, Singapore Economic Development Board, Canon Inc., and Hewlett-Packard Company, Nanya Technology Corporation, and Photronics, Inc.

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