STATS ChipPAC Ltd. company assembles and tests integrated circuits (ICs) for semiconductor manufacturers on a contract basis. STATS ChipPAC receives wafers of ICs from manufacturers which it inspects for flaws, sorts, and cuts into individual chips. It then assembles, packages, and tests them. Analog Devices, Broadcom, Freescale Semiconductor, Intel, Marvell Technology, and QUALCOMM (about 12% of sales) are among the company's top customers. About three-quarters of the company's sales come from the US, where many of the industry's fabless semiconductor companies are based.

Energy & Electric Systems, Electronic Devices, and Retail Systems. Its Energy & Electric Systems segment makes components and instruments used in automation, electric power, industrial plant, and facility construction applications. The unit also makes power semiconductors, sensors, and photoconductive drums. Its Electronic Devices group makes magnetic disks. The Retail Sytems group makes vending machines, currency handling devices, and refrigerated display cases.

Systems on Silicon Manufacturing Company wafer fabricator, or contract manufacturer, produces CMOS-based semiconductors with line widths down to 140 nanometers. It operates as a joint venture owned by Taiwan Semiconductor Manufacturing (TSMC) and NXP, 39% and 61% stakeholders, respectively. SSMC is positioned to exclusively offer manufacturing flexibility, fast turnaround, at a low cost to NXP and TSMC, which run wafer fabrication plants (fabs), too. Founded in 1998 by Phillips, TSMC, and Singapore's Economic Development Board (EDB), SSMC began churning out product in 2000. Phillips subsequently spun off NXP, with the SSMC stake. NXP and TSMC joined to buy the EDB's stake.

Espey Mfg. & Electronics Corp is a Power Electronics Design and Original Equipment Manufacturing (OEM) company with a long history of developing and delivering highly reliable products for use in military and severe environment applications. All design, manufacturing, and testing is performed in our 150,000+ square foot facility located at 233 Ballston Ave, Saratoga Springs, New York. Espey is a small business that is ISO 9001:2000 certified and publicly traded on NYSE Amex (ESP). Espey has been in business for 75 years and continues to be successful through the design and manufacture of new and improved products by using cutting edge and emerging technologies.Espey services include design and development to specification, build to print, design services, design studies, environmental testing services, metal fabrication, plating and painting services, and development of automatic testing equipment. Espey manufacturing is vertically integrated and will produce individual components (including inductors), populate printed circuit boards, fabricate metalwork, paint, plate, wire, qualify, and fully test items in house; mechanically, electrically and environmentally.Espey’s primary products are power supplies, power converters, filters, power transformers, magnetic components, power distribution equipment, ups systems, antennas and high power radar systems. The applications of these products include AC and DC locomotives, shipboard power, shipboard radar, airborne power, ground-based radar, and ground mobile power.Espey is on the eligible list of contractors on the United States Department of Defense and generally is automatically solicited by such agencies for procurement needs falling within the major classes of products produced by the company. Espey contracts with the Federal Government under cage code 20950 as Espey Mfg. & Electronics Corp. and cage code 98675 as Espey Mfg. & Electronics Corp., Saratoga Industries Division.

Anhui Tongfeng Electronics Company Limited (TFE) is principally engaged in the research, development, manufacture and sale of film capacitors and related materials. Anhui Tongfeng Electronics Company's products include capacitor polypropylene film, metalized film, capacitors, renewable resins, crystal plates, crystal resonators and oxidation preventives. Anhui Tongfeng Electronics Company's capacitors include alternating current (AC) capacitors, direct current (DC) capacitors and power capacitors for locomotives. Anhui Tongfeng Electronics Company is also involved in the sale of real estate.

FlipChip International, LLC provides merchant wafer level packaging and flip chip bumping services to the semiconductor industry. Its wafer level services include standard flip chip (SFC), redistributed SFC, Wafer UltraCSP, e-less nickel bumping WLCSP, Polymer Collar, and high frequency RF packaging; and die level services comprise dicing, optical inspection, pick-and-place, waffle-pak, tape and reel, wafer sawing, wafer probe, wafer sort, test, die trays, and ship direct of finished die to end customer. The company also performs services in various categories, which include product qualification, reliability testing, failure analysis, material characterization, and technical/expert reports. FlipChip International, LLC has strategic partnership with Semiconductor Manufacturing International Corporation. The company was incorporated in 2004 and is headquartered in Phoenix, Arizona. As of February 10, 2004, FlipChip International, LLC operates as a subsidiary of RoseStreet Labs LLC.

TeligentEMS was established in 2002 by president and CEO Chris Eldred, who purchased the assets of another company. TeligentEMS provides electronics manufacturing services, including mechanical, electronic, and system-level assembly. Specialized services include prototyping, new product introduction, material procurement, supply chain management, printed circuit board assembly, in-circuit board testing, functional board testing, final system box build, depot repair, order fulfillment services, printed circuit board development, and functional test development.

TXP Corporation is a provider of pre-manufacturing services for the electronics industry. The Company support original equipment manufacturers (OEM), original design manufacturers, contract manufacturers and technology innovators. The Company has three business unites: TXP Texas Prototypes, TXP Retrofit Solutions and TXP optical network terminals (ONT) Solutions. TXP Texas Prototype provides pre-manufacturing services for the electronics industry that help OEMs bring products to market. TXP Retrofit Solutions provides custom engineering kits to enable Incumbent Local Exchange Carriers (ILEC’s) to upgrade their local access service delivery infrastructure. TXP ONT Solutions develops and markets via an Original Design Manufacturing (ODM) model a family of ONT products to both OEMs and ILECs to be private-label branded.

Sigma Designs, Inc. company was founded in 1982 and is headquartered in Milpitas, California. Sigma Designs, Inc. is a fabless provider of integrated system-on-chip (SoC), solutions that are used to deliver multimedia entertainment throughout the home. The Company offers four distinct technologies that the Company market as separate product lines: media processors, VXP video image processing, Ultra-wideband devices and Z-wave devices. Each of these technologies also contributes to its fully integrated SoC offerings. Its SoC solutions combine its semiconductors and software and are a component of multiple high-growth, consumer applications that process digital video and audio content, including Internet protocol television (IPTV), connected media player, high definition televisions (HDTVs), and portable media players. Its media processors provide high definition digital video decoding for multiple compression standards, graphics acceleration, audio decoding, a central processing unit (CPU), and display control. In November 2009, it acquired CopperGate Communications Ltd.

Wintegra, Inc. operates as a fabless semiconductor and software company that enables communications companies to build access networks. It engages in the design, development, and marketing of single-chip solutions. The company provides silicon and software solutions focused on the access infrastructure. It offers WinPath access packet processor solutions, which are used by various telecom and networking equipment manufacturers in a range of communications equipment that allows service providers to deploy the voice, video, data, and wireless services to their end customers. These include WIN777, an access packet processor that includes a MIPS 64-bit 5Kc core for control path operations and proprietary RISC engines for data path operations; WIN770, which rely on an external PowerPC for control plane operations; WIN737, a device for DSLAMs; and WIN787, which integrates dual Gigabit Ethernet MACs.Wintegra company also offers a reference board, known as Wintegra Development System, which has a PowerPC daughtercard for PPC-based control plane development. Wintegra targets access infrastructure equipment used in markets, such as wireless infrastructure, digital subscriber line, optical access, multiservice access, and voice over Internet protocol. The company markets and sells its access processor solutions to OEMs, ODMs, and subsystem manufacturers worldwide. It has partnerships with Altera Corporation; Corelis, Inc.; Green Hills Software, Inc.; SBS Technologies, Inc.; The Telecommunications Industry Association; Tundra Semiconductor Corporation; Abatron AG; Asidua, Ltd.; DSL Forum; Enea; Future Software Limited; Flextronics Software Systems; picoChip Designs Limited; Motorola, Inc.; MontaVista Software, Inc.; and Ikanos Communications, Inc.

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