Dave Carter & Associates company distributes a diversity of electrical equipment, plumbing supplies, and building materials for the home. For those who call the open road home, Dave Carter also supplies a full slate of recreational vehicle parts and equipment. Its catalog includes air conditioning and heating systems, carpet pad, doors, drywall, fans, lighting fixtures, mini-blinds, plumbing supplies, skylights, and wire. Customers are served through some 20 branch locations crisscrossing the US. Founded in 1977, the company is owned and operated by its founder and chairman David Carter, Sr.

Multi-Fineline Electronix, Inc. engages in the engineering, design, and manufacture of flexible printed circuit boards and related component assemblies for the electronics industry. The company’s products are used in feature phones, smart phones, consumer electronic devices, portable bar code scanners, computer/storage devices, and medical devices. It sells its products primarily through its design and application engineers. Multi-Fineline Electronix serves original equipment manufacturers, electronic manufacturing service providers, and display manufacturers. It operates primarily in the United States, China, Singapore, Malaysia, and the United Kingdom. The company was founded in 1984 and is headquartered in Anaheim, California. Multi-Fineline Electronix, Inc. is a subsidiary of WBL Corporation Limited.

Amphenol is one of the largest manufacturers of interconnect products in the world. The Company designs, manufactures and markets electrical, electronic and fiber optic connectors, coaxial and flat-ribbon cable, and interconnect systems. The primary end markets for the Company's products are communications and information processing markets, including cable television, cellular telephone and data communication and information processing systems; aerospace and military electronics; and automotive, rail and other transportation and industrial applications.

Heilind Electronics company has locations in Connecticut, Florida, Georgia, Illinois, Massachusetts, Minnesota, New Jersey, New York, North Carolina, Ohio, Pennsylvania, and Wisconsin, and in Ontario, Canada. It carries products from such manufacturers as 3M, Framatome Connectors International (FCI), Molex, Panduit, Samtec, Spectrum Control, and Tyco Electronics (AMP connectors and Raychem components). Heilind also provides component modification and assembly services, along with supply chain management services.

Micron Technology, Inc. company was founded in 1978 and is headquartered in Boise, Idaho. Micron Technology, Inc., together with its subsidiaries, engages in the manufacture and marketing of semiconductor devices worldwide. Its products include dynamic random access memory (DRAM) products that provide data storage and retrieval, which include DDR, DDR2, DDR3, and other specialty DRAM memory products, such as SDRAM, mobile DRAM, pseudo-static RAM, and reduced latency DRAM. The company also offers NAND flash memory products, which are electrically re-writeable and non-volatile semiconductor devices that retain content when power is turned off. Micron Technology’s products are used in a range of electronic applications, including personal computers, workstations, network servers, mobile phones, flash memory cards, USB storage devices, digital still cameras, MP3/4 players, and in automotive applications. It sells its products to original equipment manufacturers and retailers through internal sales force, independent sales representatives, and distributors, as well as Web-based customer direct sales channel. Micron Technology, Inc. has joint ventures with Intel Corporation, Singapore Economic Development Board, Canon Inc., and Hewlett-Packard Company, Nanya Technology Corporation, and Photronics, Inc.

Systems on Silicon Manufacturing Company wafer fabricator, or contract manufacturer, produces CMOS-based semiconductors with line widths down to 140 nanometers. It operates as a joint venture owned by Taiwan Semiconductor Manufacturing (TSMC) and NXP, 39% and 61% stakeholders, respectively. SSMC is positioned to exclusively offer manufacturing flexibility, fast turnaround, at a low cost to NXP and TSMC, which run wafer fabrication plants (fabs), too. Founded in 1998 by Phillips, TSMC, and Singapore's Economic Development Board (EDB), SSMC began churning out product in 2000. Phillips subsequently spun off NXP, with the SSMC stake. NXP and TSMC joined to buy the EDB's stake.

Infiniti Solutions, Ltd. provides semiconductor test and assembly services. Its semiconductor services include packaging solutions, including package design and development, thermal and electrical modeling, process development, material selection, and system in a package; test solutions, such as design for test, test program development and conversion, test flow development, test time reduction, load board and probe card design, burn-in board design and fabrication, and burn-in systems; and prototyping, including device characterization, reliability services, product and package failure analysis, PCB assembly for development kit, and quick turn assembly. The company’s mass production services include wafer sort; assembly; test, including electrical test, burn-in, and environmental; failure analysis, such as parametric electrical test, real-time X-ray, optical and C-mode scanning acoustic microscopy, and SEM/EDX; reliability, including moisture sensitivity test, high temperature and temperature cycling treatment, HAST, solderability test, HTOL, and ESD; end of line services, such as laser marking, bake, scan, and tape and reel; warehousing and logistics, including packing, storage, and drop-shipment. It also designs and manufactures burn-in boards and systems, as well as printed circuit boards.

Silicon Laboratories Inc. company was founded in 1996 and is headquartered in Austin, Texas. Silicon Laboratories Inc. engages in the design and development of analog-intensive and mixed-signal integrated circuits (ICs). It offers broadcast products, which include broadcast radio receivers and transmitters, video tuners and demodulators, satellite set-top box receivers, and satellite radio tuners; access products that comprise ISOmodem embedded modems, voice over IP products, and power over ethernet devices; broad-based products, including 8-bit microcontroller products, timing products, short-range wireless transceivers, isolators, current sensors and QuickSense portfolio of touch, and proximity and ambient light sensing devices; and mature products comprising silicon DAA for PC modems, DSL analog front end ICs, optical physical layer transceivers, and RF synthesizers. Silicon Laboratories company's products are used in a range of applications, including portable devices, satellite set top boxes, AM/FM radios and other consumer electronics, networking equipment, test and measurement equipment, industrial monitoring and control, central office telephone equipment, and customer premises equipment. Silicon Laboratories markets its products directly, as well as through a network of independent sales representatives, and distributors in the United States, Taiwan, China, South Korea, and the rest of world.

BE Semiconductor Industries N.V. was founded in 1995. BE Semiconductor Industries N.V., through its subsidiaries, engages in the design, manufacture, marketing and servicing of assembly equipment for the semiconductor industry. The company manufactures semiconductor die sorting, flip chip and multi-chip die bonding, packaging and plating equipment, for both array connect and leadframe assembly processes. The company’s equipment and integrated systems are used to produce semiconductor assemblies or ‘packages’, which provide the electronic interface and physical connection between the chip and other electronic components and protect the chip from the external environment. The company’s products are used to assemble chips for various end-use applications including electronics, computer, automotive, industrial, RFID (Radio Frequency Identification Device) and solar energy. Product groups Die bonding equipment: It includes single, multi-chip and flip chip die bonding systems which place the chip onto a multi-layer substrate; and Die sorting systems, which are used to inspect, select and sort bare dies, flip chips, wafer level chip scale packages and opto-electronic devices for further processing in assembly operations. Packaging equipment: It consists of molding systems that encapsulate bonded semiconductor devices in epoxy resin; Trim and form systems used to cut and then form metallic leads of encapsulated semiconductor devices in leadframe applications; and Singulation systems used to cut packaged array connect devices. Plating equipment: It consists of automated tin plating and spot plating systems for conventional leadframe applications; and antenna plating systems for new RFID and thin film solar cell applications.

ASML Holding N.V. (ASML) is a holding company, which operates through its subsidiaries. The Company is a provider of advanced technology systems for the semiconductor industry. It offers an integrated portfolio of lithography systems mainly for manufacturing complex integrated circuits (semiconductors, ICs or chips). The Company supplies lithography systems to IC manufacturers throughout Asia, the United States and Europe and also provides its customers with a range of support services from advanced process and product applications knowledge to complete round-the-clock service support. ASML’s wholly owned operating subsidiaries include ASML Netherlands B.V., ASML Hong Kong Limited and ASML IS, Inc. In July 2009, ASML introduced FlexRay programmable illumination and BaseLiner scanner matching technology, which offer scanner stability optimization and stabilize manufacturing process windows.

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