OSI Systems, Inc. was founded in 1987 and is headquartered in Hawthorne, California. OSI Systems, Inc., together with its subsidiaries, is a vertically integrated designer and manufacturer of specialized electronic systems and components for critical applications. The Company sells its products in diversified markets, including homeland security, healthcare, defense and aerospace. The Company has three operating divisions. Through its Security division, the Company designs, manufactures and markets security and inspection systems worldwide to end users under the Rapiscan Systems trade name. The Healthcare division designs, manufactures and markets patient monitoring, diagnostic cardiology and anesthesia delivery and ventilation systems worldwide to end users under the Spacelabs trade name. The Optoelectronics and Manufacturing division designs, manufactures and markets optoelectronic devices and provide electronics manufacturing services worldwide for use in a range of applications. On July 28, 2009, the Company acquired certain assets of RAD Electronics, Inc.

STMicroelectronics NV was founded in 1987 and is headquartered in Geneva, Switzerland. STMicroelectronics N.V. is a global independent semiconductor company that designs, develops, manufactures and markets a range of semiconductor products used in a range of microelectronic applications, including automotive products, computer peripherals, telecommunications systems, consumer products, industrial automation and control systems. The products of the Company are manufactured and designed using a range of manufacturing processes and design methods. The Company uses all of the prevalent function-oriented process technologies, including complementary metal-on silicon oxide semiconductor (CMOS), bipolar and nonvolatile memory technologies. In addition, it has developed advanced systems-oriented technologies to produce differentiated and application-specific products, including bipolar CMOS technologies (BiCMOS) for mixed-signal applications, and diffused metal-on silicon oxide semiconductor (DMOS) technology and bipolar, CMOS and DMOS (BCD technologies).

OECO, LLC is based in Milwaukie, Oregon and focuses on custom design for manufacturing, and environmental testing of electro-magnetic devices and power conversion products for defense electronics, commercial aerospace and medical sectors. With over 300 employees and exceptionally qualified engineers, OECO is a leading supplier to major customers such as Boeing, Raytheon, Honeywell, de Havilland, GE, BAE Systems, IBM, ITT, Lockheed Martin, Northrop Grumman, Sikorsky, the US Government, and Medtronic. OECO has been supplying its customers with highly engineered and reliable products that are the result of an ongoing commitment to continued technological advances through our many engineering and manufacturing process initiatives.

Orbotech Ltd., together with its subsidiaries, engages in the design, development, manufacture, marketing, and service of production solutions for specialized applications in the supply chain of the electronics industry worldwide. he company provides automated optical inspection (AOI), production and imaging products for specialized applications in the manufacture of printed circuit boards (PCB) and AOI; test and repair systems for flat panel displays; and automatic check reading products enabled through its recognition software and gamma cameras for use in nuclear cardiac imaging. It also markets computer aided manufacturing solutions for PCB production; develops and markets character recognition solution to banks and other financial institutions; and provides technology for Web-based and location-independent data entry for check and forms processing. The company was formerly known as Optrotech Ltd. and changed its name to Orbotech Ltd. in October 1992 as a result of merger with Orbot Systems Ltd. Orbotech was founded in 1981 and is headquartered in Yavne, Israel.

ULVAC,Inc. is a Japan-based company mainly engaged in the provision of vacuum equipment, machinery and services. The Company operates in two business segments. The Vacuum-related segment provides display and electronic parts manufacturing equipment, semiconductor manufacturing equipment and components. Its major products include sputtering systems, chemical vapor deposition (CVD) systems, etching systems, vacuum evaporation systems and vacuum heat treatment furnaces. The Others segment provides sputtering target materials, vacuum evaporation materials, titanium and tantalum processing products, surface treatment and precision cleaning services, Auger electron spectroscopy analyzers, X-ray photoelectron analyzers, secondary ion mass spectroscopy analyzers, various industrial machinery control devices, high voltage inverters, power source converters and uninterruptible power source devices. The Company has 55 subsidiaries and six associated companies.

PSi Technologies Holdings makes packages that hold power semiconductors in the silicon equivalent of a full nelson. The company provides packaging and assembly services to top chip makers, such as Infineon (about 49% of sales), ON Semiconductor, STMicroelectronics (22%), and Texas Instruments. PSi Technologies takes customers' semiconductors and embeds them into protective casings in preparation for use; it specializes in working with power management semiconductors, such as field-effect transistors and voltage regulators -- devices that are built to handle high power levels and that require heavy-duty packaging techniques. Customers in Europe account for about three-quarters of sales.

Advanced Semiconductor Engineering, Inc. was founded in 1984 and is based in Kaohsiung, Taiwan. Advanced Semiconductor Engineering, Inc., together with its subsidiaries, provides semiconductor packaging and testing services for semiconductor companies. Its services include semiconductor packaging; design and production of interconnect materials; front-end engineering testing; and wafer probing and final testing services. The company offers various leadframe-based package types, such as quad flat package, thin quad flat package, and bump chip carrier and quad flat no-lead package; package types based on substrates, including flip-chip BGA and other BGA types; and wafer-bumping products. Its testing services comprise front-end engineering testing, wafer probing, and final testing of logic/mixed-signal/radio frequency and memory semiconductors, as well as other test-related services, such as burn-in testing, module sip testing, dry pack, tape and reel, and electric interface board and mechanical test tool design. The company packages semiconductors for use in a range of end-use applications, including communications, computers, consumer electronics, industrial, automotive, and other applications. It sells its products primarily in Taiwan, the United States, Asia, and Europe.

MiTAC International designs, manufactures, sells, and services consumer and enterprise electronics products for leading vendors, such as Dell and Sun Microsystems. Production capabilities encompass desktop computers, servers, workstations, data storage systems, handheld computers, handsets, and wireless networking cards. In addition to customary contract manufacturing services, MiTAC offers tooling, warehousing, and supply chain management services. The company owns 40% of SYNNEX, a US-based contract manufacturer and distributor. MiTAC operates through four business units, which include client systems, enterprise systems, mobile communications, and the TYAN unit.

HEIDENHAIN company develops and makes angular, linear, and rotary encoders, digital readouts, length gauges, and numerical controls for semiconductor and electronics manufacturers for use in measuring equipment and automated production machines. Its encoders measure rotation accuracy and thermal stability, while its controls are used in milling, drilling, and boring machines. HEIDENHAIN's devices have also been applied in telescope projects and satellite-receiving antennas. HEIDENHAIN is the North American wholly owned subsidiary of Dr. Johannes Heidenhain GmbH, a German manufacturer of precision measurement and control equipment.

Kyocera Corporation, through its subsidiaries, manufactures and distributes fine ceramic components, electronics devices, and equipment to individuals, corporations, and governments and governmental agencies worldwide. Its Fine Ceramic Parts segment offers information and telecommunication components, sapphire substrates, components for semiconductor process equipment components, components for liquid crystal display (LCD) manufacturing equipment, automotive components, and general industrial ceramic components.The company's Semiconductor Parts segment provides ceramic packages for crystal and SAW devices, CCD/CMOS sensor ceramic packages, LSI ceramic packages, wireless and optical communication device packages, and organic multilayer packages and substrates. Its Applied Ceramic Products segment offers residential and industrial solar power generating systems, solar cells/modules, cutting tools, micro drills, medical and dental implants, jewelry, and applied products.The companys Electronic Device segment provides ceramic and tantalum capacitors, timing devices, surface acoustic wave devices, RF modules, EMI filters, connectors, thermal and inkjet print heads, amorphous silicon photoreceptor drums, and LCDs. Its Telecommunications Equipment segment offers CDMA mobile phone handsets and personal handy phone system related products. The company's Information Equipment segment provides ECOSYS printers, copying machines, and multifunctional peripherals. Its Other segment involves in telecommunications engineering; integration business on information systems and network infrastructures; data center; management consulting; and hotel business, as well as chemical materials for electronic components, electrical insulators, and molded products. The company was formerly known as Kyoto Ceramic Kabushiki Kaisha and changed its name to Kyocera Corporation.

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