Semitool, Inc. (Semitool) designs, manufactures, installs and services engineered equipment for use in the fabrication of semiconductor devices. The Company’s products are focused on the wet chemical process steps in integrated circuit (IC) manufacturing and include systems for wafer surface preparation and electrochemical deposition (ECD) applications. The Company’s surface preparation systems are designed for Front End of Line (FEOL), Back End of Line (BEOL) and wafer level packaging of ICs processes. The Company’s single-wafer FEOL surface preparation systems are used for photoresist stripping, post etch and pre-diffusion cleans. The Company’s ECD systems are used to plate copper and other metals, which are used for the IC’s internal wiring, or interconnects; to plate solder and lead free solder bumps, and to plate other metals for a range of semiconductor and related applications. In December 2009, Applied Materials, Inc. acquired Semitool, Inc.

BE Semiconductor Industries N.V. was founded in 1995. BE Semiconductor Industries N.V., through its subsidiaries, engages in the design, manufacture, marketing and servicing of assembly equipment for the semiconductor industry. The company manufactures semiconductor die sorting, flip chip and multi-chip die bonding, packaging and plating equipment, for both array connect and leadframe assembly processes. The company’s equipment and integrated systems are used to produce semiconductor assemblies or ‘packages’, which provide the electronic interface and physical connection between the chip and other electronic components and protect the chip from the external environment. The company’s products are used to assemble chips for various end-use applications including electronics, computer, automotive, industrial, RFID (Radio Frequency Identification Device) and solar energy. Product groups Die bonding equipment: It includes single, multi-chip and flip chip die bonding systems which place the chip onto a multi-layer substrate; and Die sorting systems, which are used to inspect, select and sort bare dies, flip chips, wafer level chip scale packages and opto-electronic devices for further processing in assembly operations. Packaging equipment: It consists of molding systems that encapsulate bonded semiconductor devices in epoxy resin; Trim and form systems used to cut and then form metallic leads of encapsulated semiconductor devices in leadframe applications; and Singulation systems used to cut packaged array connect devices. Plating equipment: It consists of automated tin plating and spot plating systems for conventional leadframe applications; and antenna plating systems for new RFID and thin film solar cell applications.

SMTC stays ahead by working behind the scenes. The company provides contract electronics manufacturing services, such as surface-mount and through-hole circuit board assembly, product design and prototyping, testing, inspection, packaging, and supply chain management. Manufacturers use products built or assembled by SMTC in their computer servers, networking devices, and communications products. The company also makes enclosures for electronic systems, as well as power and telecom cable interconnection assemblies. Leading customers are Ingenico (19% of sales), Harris (15%), and MEI (14%). Customers in the US account for half of sales.

Lattice Semiconductor Corporation company was founded in 1983 and is headquartered in Hillsboro, Oregon. Lattice Semiconductor Corporation engages in the design, development, and marketing of programmable logic products and related software. It offers field programmable gate array (FPGA) products, including LatticeECP family, which is designed for customers who need FPGAs with digital signal processing, and is also used to deploy in wireless infrastructure and wireline access equipment, as well as video and imaging applications; LatticeXP, the non-volatile LatticeXP FPGA family embed a flash memory block on-chip to store the program; and LatticeSC that combines a high performance FPGA fabric with high-speed serial communication channels, large memories, and high-speed IO. The company also offers programmable logic device (PLDs) products consisting of ispMACH4000, an in-system programmable complex programmable logic device (CPLD) family; spMach4000ZE that targets handheld and portable equipment; MachXO family of various non-volatile reconfigurable PLDs, designed for applications implemented using CPLDs; and power manager and ispClock programmable mixed signal devices.

Silterra aims to supply silky-smooth service to chip makers. The silicon foundry company supplies contract manufacturing services: customers send their own designs to Silterra, which then produces finished chips in its wafer fabrication facilities. Approximately half of its products are shipped to the US; Taiwan and South Korea each receive 25%. Silterra's investors include two investment arms of Malaysia's Ministry of Finance, which owns about two-thirds of Silterra, as well as LSI Corp., Seiko, Bank Industri Malaysia, and Walden Holdings. Silterra was founded in 1995 as Wafer Technology (Malaysia) Sdn. Bhd. and first began producing semiconductors in late 2000.

Advanced Micro Devices, Inc. was founded in 1969 and is headquartered in Sunnyvale, California. Advanced Micro Devices, Inc. is a global semiconductor company with facilities around the world. The Company offer x86 microprocessors, for the commercial and consumer markets, embedded microprocessors for commercial, commercial client and consumer markets and chipsets for desktop and notebook personal computers (PCs), professional workstations and servers. It offers graphics, video and multimedia products for desktop and notebook PCs, including home media PCs, professional workstations and servers and technology for game consoles. The Company operates in two business segments: computing solutions, which includes chipsets, and graphics. In June 2008, the Company launched the Puma platform, which was the code name for the mainstream notebook platform. In January 2009, the Company launched the Yukon platform. In March 2008, the Company introduced the AMD Phenom X3 8000 series triple-core processors. In March 2009, the Company completed the spin off of its manufacturing operations.

Nanya Technology Corp. is principally engaged in the manufacture, development and sale of memory products. The Company primarily offers dynamic random access memory (DRAM) chips, including double data rate (DDR) DRAM chips, DDR2 DRAM chips and DDR3 DRAM chips; DRAM modules, such as 200-pin DDR small outline (SO) dual in-line memory modules (DIMMs), 184-pin registered and unbuffered DDR synchronous dynamic random access memory (SDRAM) DIMMs, 200-pin DDR2 SODIMMs, 240-pin unbuffered and registered DDR2 SDRAM DIMMs, 204 pin DDR3 SODIMMs, 240 pin unbuffered and registered DDR3 SDRAM DIMMs and others. DRAMs are used as data storage units for computer, communications and consumer (3C) products.

Applied Materials, Inc. was founded in 1967 and is headquartered in Santa Clara, California. Applied Materials, Inc. (Applied) provides Nanomanufacturing Technology solutions for the global semiconductor, flat panel display, solar and related industries, with a portfolio of equipment, service and software products. The Company’s customers include manufacturers of semiconductor wafers and chips, flat panel liquid crystal displays, solar photovoltaic cells and modules (solar PVs), and other electronic devices. It operates in four segments: Silicon, Applied Global Services, Display, and Energy and Environmental Solutions. Applied’s Silicon Systems Group (SSG) develops, manufactures and sells a range of manufacturing equipment used to fabricate semiconductor chips, also referred to as integrated circuits (ICs). The services and products offered by the Applied Global Services segment include Fab Services, Mature Technology Services, Automation Systems and Abatement Systems. In December 2009, Applied Materials, Inc. acquired Semitool, Inc.

LEA International, a subsidiary of Smiths Group plc, makes surge suppression equipment. Its products range from large-scale equipment for telecom and utilities applications to protectors for home electronics. Other applications include broadcast, data center, medical, and manufacturing operations.

Applied Micro Circuits Corporation designs, develops, markets, and supports integrated circuits for processing, transporting, and storing of information worldwide. It offers integrated communications products that include physical layer products, which transmits and receives signals in a high-speed serial format, and converts high-speed serial formats to low-speed parallel formats; framer and mapper products, which transmits and receives signals to and from the physical layer in a parallel format; and embedded processor products for wireless infrastructure, wireless LAN, and high-end storage markets. The company's integrated communications products also include packet processing products, which receives and transmits signals to and from the framing layer and perform the processing of packet and cell headers; and cell switching products, which include packet routing switch fabric devices. Its products are used in wireline and wireless communications equipment, such as wireless access points, wireless base stations, multi-function printers, edge switches, gateways, metro transport platforms, core switches, and routers. The company has operations in North America, Europe, and Asia. Applied Micro Circuits Corporation was founded in 1979 and is headquartered in Sunnyvale, California.

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