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Advanced Systems Automation Limited is a Singapore-based company. The principal activities of the Company consist of the design and manufacture of automatic molding machines and other back-ended assembly equipment for the semi-conductor industry. The Company operates in two business segments: Equipment and Equipment Contract Manufacturing Services (ECMS). The Equipment segment is mainly engaged in designs and manufactures Automatic Moulding machines and other back-ended assembly equipment for the semi-conductor industry. The ECMS segment is mainly engaged in precision engineering, fabrication assembly of parts for both semi-conductor and non-semiconductor industries. The Company’s subsidiaries include Avalon Technology Pte Limited and Beijing Microfits Precision Electronics Engineering Co., Limited. As of March 18, 2008, Asti Holdings Limited held a 40.43% interest in the Company.

Advantest established its first representative office in the States in 1973 and founded Advantest America in 1982. Advantest America Corporation manufactures and distributes electronic measuring instruments and semiconductor test equipment used in the development and manufacture of computer and telecommunications products. Products include handlers, interconnect products, and testers. The company is the North American subsidiary of Advantest Corporation and was established to expand the automatic test equipment business (ATE) in the US. It has 13 offices throughout the US and an R&D Center located in California. The Japanese parent company gets about 15% of its annual sales from the Americas.

Advantest Corporation company was founded in 1954 and is based in Tokyo, Japan. Advantest Corporation (Advantest) is a part of Advantest group. The Company operates in three segments: semiconductor and component test system segment; mechatronics system segment, and services, support and others. The semiconductor and component test system segment provides customers with test system products for the semiconductor industry and the electronic component industry. The products in this segment include test systems for memory semiconductors and test systems for non memory semiconductors. The test systems for non memory semiconductors are divided into test systems for system-on-chip (SoC) semiconductors, liquid crystal display (LCD) driver integrated circuits (ICs) and semiconductors used in car electronics. The mechatronics system segment focuses on peripheral devices to the semiconductor and component test systems.

Aehr Test Systems was founded in 1977 and is headquartered in Fremont, California. Aehr Test Systems (Aehr Test) develops, manufactures and sells systems, which are designed to reduce the cost of testing flash, dynamic random access memory (DRAM), and other memory devices, and to perform reliability screening or burn-in of complex logic and memory devices. These systems can be used to perform parallel testing and burn-in of packaged integrated circuits (ICs), singulated bare die, or ICs still in wafer form. The Company has developed and introduced several product families, including the ABTS, FOX, MTX and MAX systems, the WaferPak cartridge and the DiePakR carrier. The Company manufactures and markets full wafer contact systems, monitored burn-in systems, massively parallel test systems, test fixtures, die carriers and related accessories. The Company markets and sells its products to semiconductor manufacturers, semiconductor contract assemblers, electronics manufacturers and burn-in and test service companies.

AEM Holdings Ltd. (AEM) is primarily engaged in the design, development and manufacture of organic substrates, integrated systems manufacturing equipment, precision engineering products and electro-plating chemicals and services for the semi-conductors and other industries. AEM’s business is organised into 3 main divisions: substrates and system packaging (SSP), precision and system integration (PSI) and materials and services (MNS). SSP products include ball-gridarray (BGA) packages, chip-scale packages (CSP), flip chips, advanced RF modules and systems-in-package (SIP). PSI products include laser marking, de-flashing, electroplating, solder dipping, vision inspection, lead conditioning, packaging systems and chip test handlers. MNS products include test sockets, device change kits, stiffeners and preventive maintenance kits, as well as distribution of engineering plastic products.

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