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AEM Holdings Ltd. (AEM) is primarily engaged in the design, development and manufacture of organic substrates, integrated systems manufacturing equipment, precision engineering products and electro-plating chemicals and services for the semi-conductors and other industries. AEM’s business is organised into 3 main divisions: substrates and system packaging (SSP), precision and system integration (PSI) and materials and services (MNS). SSP products include ball-gridarray (BGA) packages, chip-scale packages (CSP), flip chips, advanced RF modules and systems-in-package (SIP). PSI products include laser marking, de-flashing, electroplating, solder dipping, vision inspection, lead conditioning, packaging systems and chip test handlers. MNS products include test sockets, device change kits, stiffeners and preventive maintenance kits, as well as distribution of engineering plastic products.

AIXTRON AG (AIXTRON) is a provider of deposition equipment to the semiconductor industry. The Company's technology solutions are used by a range of customers globally to build components for electronic and opto-electronic applications based on compound, silicon, or organic semiconductor materials. The components are used in displays, signaling, lighting, fiber optic communication systems, wireless and mobile telephony applications, optical and electronic storage devices, computing, as well as a range of other technologies. AIXTRON's business activities include developing, producing and installing equipment for coating semiconductor materials, process engineering, consulting and training, including ongoing customer support. It supplies to customers both full production-scale chemical vapor deposition systems and small scale systems for research and development use and small-scale production use.

Akrion Systems LLC company makes surface preparation equipment that readies semiconductor wafers for high-precision processes during manufacturing of microchips and other high-tech components. Akrion's tools are used in producing logic and memory parts, microelectromechanical system (MEMS) devices, photovoltaic solar cells, flat-panel displays, and photomasks. Its customers include Analog Devices, BAE SYSTEMS, Hewlett-Packard, Intel, MEMC Electronic Materials, Micron Technology, and Samsung Electronics. In 2008 Akrion's assets were acquired by Bayside Capital, an affiliate of H.I.G. Capital.

AmberWave Systems Corporation engages in the research, development, and licensing of technologies for semiconductor manufacturing. It provides Strained Silicon, a technology that is used in microchips to improve performance and decrease power consumption; and Aspect Ratio Trapping, a technology, which is used to make chips for silicon-based photonics and photovoltaic cells. The company was founded in 1998 and is headquartered in Salem, New Hampshire. AmberWave Systems Corporation is a former subsidiary of U.S. Robotics Corp.

American Semi was founded in 2001 and is owned by CEO Doug Hackler. American Semiconductor offers silicon foundry services, providing services that range from design to custom wafer fabrication. The company uses its Flexfet process to produce wafers that are ultra low power and radiation tolerant. Its Multi-Project Wafer (MPW) program gives more customers access to Flexfet technology by combining multiple designs on a single wafer lot, making prototypes more cost-effective. The firm also performs research in semiconductor materials for the US Department of Defense and other government agencies, providing analytical services on chips and chip-making processes.

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