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Axcelis Technologies was founded in 1995 and is headquartered in Beverly, Massachusetts. Axcelis Technologies, Inc. (Axcelis) designs, manufactures and services ion implantation, dry strip and other processing equipment used in the fabrication of semiconductor chips. In addition to equipment, the Company provides aftermarket service and support, including spare parts, equipment upgrades, maintenance services and customer training. During the year ended December 31, 2008, the Company owned 50% of the equity of SEN Corporation (SEN), a producer of ion implantation equipment in Japan. SEN licenses technology from the Company for certain ion implantation products and has exclusive rights to market the licensed products in Japan. In February 2009, the Company entered into an agreement to sell its shares in SEN, which closed on March 30, 2009.

BE Semiconductor Industries N.V. was founded in 1995. BE Semiconductor Industries N.V., through its subsidiaries, engages in the design, manufacture, marketing and servicing of assembly equipment for the semiconductor industry. The company manufactures semiconductor die sorting, flip chip and multi-chip die bonding, packaging and plating equipment, for both array connect and leadframe assembly processes. The company’s equipment and integrated systems are used to produce semiconductor assemblies or ‘packages’, which provide the electronic interface and physical connection between the chip and other electronic components and protect the chip from the external environment. The company’s products are used to assemble chips for various end-use applications including electronics, computer, automotive, industrial, RFID (Radio Frequency Identification Device) and solar energy. Product groups Die bonding equipment: It includes single, multi-chip and flip chip die bonding systems which place the chip onto a multi-layer substrate; and Die sorting systems, which are used to inspect, select and sort bare dies, flip chips, wafer level chip scale packages and opto-electronic devices for further processing in assembly operations. Packaging equipment: It consists of molding systems that encapsulate bonded semiconductor devices in epoxy resin; Trim and form systems used to cut and then form metallic leads of encapsulated semiconductor devices in leadframe applications; and Singulation systems used to cut packaged array connect devices. Plating equipment: It consists of automated tin plating and spot plating systems for conventional leadframe applications; and antenna plating systems for new RFID and thin film solar cell applications.

Brooks Automation Inc. company was founded in 1978 and is headquartered in Chelmsford, Massachusetts. Brooks Automation, Inc. (Brooks) is a provider of automation, vacuum and instrumentation solutions and is a business partner to original equipment manufacturers (OEM) and equipment users throughout the world. The Company also provides solutions to customers in data storage, advanced display, analytical instruments and solar markets. Brooks operates in three segments: Critical Solutions Group, Systems Solutions Group and Global Customer Operations. The Critical Solutions Group segment provides a variety of products critical to technology equipment productivity and availability. The Systems Solutions Group segment provides a range of products and engineering and manufacturing services. The Global Customer Operations segment provides a range of support services.

Brooks Automation Inc. company was founded in 1978 and is headquartered in Chelmsford, Massachusetts. Brooks Automation, Inc. (Brooks) is a provider of automation, vacuum and instrumentation solutions and is a business partner to original equipment manufacturers (OEM) and equipment users throughout the world. The Company also provides solutions to customers in data storage, advanced display, analytical instruments and solar markets. Brooks operates in three segments: Critical Solutions Group, Systems Solutions Group and Global Customer Operations. The Critical Solutions Group segment provides a variety of products critical to technology equipment productivity and availability. The Systems Solutions Group segment provides a range of products and engineering and manufacturing services. The Global Customer Operations segment provides a range of support services.

BTU International, Inc. was founded in 1950 and is headquartered in Billerica, Massachusetts. BTU International, Inc. (BTU) is a supplier of thermal processing equipment to the alternative energy and electronics manufacturing markets. BTU equipment and processes are used in the production of solar cells, nuclear fuel and fuel cells, as well as in printed circuit board assembly and semiconductor packaging. In the solar market, BTU offers processing equipment for both silicon and thin film photovoltaics. In thin film photovoltaics, BTU’s equipment is used for both the copper indium gallium selenide (CIGS) and cadmium telluride (CdTe) processes. Silicon photovoltaic applications are served by BTU’s metallization furnaces and in-line diffusion systems. Also in alternative energy, its customers use its thermal systems for the processing of nuclear fuel and the manufacturing of fuel cells. The Company’s convection solder reflow systems are used to attach electronic components to the printed circuit boards, primarily in the surface mount segments of this market.

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