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ASM International N.V. is a leading supplier of semiconductor process equipment in both front- and back-end markets. The Company possesses a strong technological base, state-of-the-art manufacturing facilities, a competent and qualified workforce and a highly trained, strategically distributed support network. Each of ASM International's major products are qualified for 300mm wafer processing. This and other leading-edge process and equipment developments ensure ASM International a position of strength and growth for many years. ASM International and its subsidiaries provide production solutions for wafer processing, assembly and packaging of semiconductor devices through their facilities in the United States, Europe, Japan and Asia. The Company is headquartered in Almere, The Netherlands.

ASM International founded ASMPT in 1975. ASM Pacific Technology (ASMPT) is one of the world's largest assembly and packaging equipment suppliers for the semiconductor industry. The company makes assembly and packaging equipment for the microelectronics, semiconductor, photonics, and optoelectronics industries. Its products help lay down the pathways on microchips and include etched and stamped lead frames; wafer bumpers; snap curing ovens; and die, wire, and flip chip bonders. ASMPT operates manufacturing facilities in China, Hong Kong, Malaysia, and Singapore. Netherlands-based ASM International owns about 53% of ASMPT.

ASML Holding N.V. (ASML) is a holding company, which operates through its subsidiaries. The Company is a provider of advanced technology systems for the semiconductor industry. It offers an integrated portfolio of lithography systems mainly for manufacturing complex integrated circuits (semiconductors, ICs or chips). The Company supplies lithography systems to IC manufacturers throughout Asia, the United States and Europe and also provides its customers with a range of support services from advanced process and product applications knowledge to complete round-the-clock service support. ASML’s wholly owned operating subsidiaries include ASML Netherlands B.V., ASML Hong Kong Limited and ASML IS, Inc. In July 2009, ASML introduced FlexRay programmable illumination and BaseLiner scanner matching technology, which offer scanner stability optimization and stabilize manufacturing process windows.

ATMI, Inc. was founded in 1986 and is headquartered in Danbury, Connecticut. ATMI, Inc. (ATMI) is a supplier of high performance materials, materials packaging and materials delivery systems used worldwide in the manufacture of microelectronics devices. The Company products consist of front-end semiconductor performance materials, sub-atmospheric pressure gas delivery systems for safe handling and delivery of toxic and hazardous gases to semiconductor process equipment, high-purity materials packaging and dispensing systems that allow for the reliable introduction of low volatility liquids and solids to microelectronics and biopharmaceutical processes. ATMI targets semiconductor and flat-panel display manufacturers, whose products form the foundation of microelectronics technology proliferating through the consumer products, information technology, automotive, healthcare and communications industries. ATMI serves three markets: integrated circuit (IC) fabrication, flat-panel displays and the life sciences market.

Aviza Technology, Inc. designs, manufactures, sells and supports semiconductor capital equipment and process technologies for the global semiconductor industry and related markets. The Company’s systems are used in a variety of segments of the semiconductor market, including silicon processing for memory devices, advanced three-dimensional packaging and power integrated circuits for communications. It focuses on designing systems that enable device manufacturers to meet technological and manufacturing requirements. Aviza Technology, Inc. offers both front-end-of-line and back-end-of-line systems and process technologies used for the aforementioned markets addressing critical thin film formation technologies, including atomic layer deposition, physical vapor deposition, chemical vapor deposition, plasma etch and thermal processing systems. In June 2009, the Company and its subsidiaries filed a voluntary petition under Chapter 11 of the United States Bankruptcy Code.

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