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Semitool, Inc. (Semitool) designs, manufactures, installs and services engineered equipment for use in the fabrication of semiconductor devices. The Company’s products are focused on the wet chemical process steps in integrated circuit (IC) manufacturing and include systems for wafer surface preparation and electrochemical deposition (ECD) applications. The Company’s surface preparation systems are designed for Front End of Line (FEOL), Back End of Line (BEOL) and wafer level packaging of ICs processes. The Company’s single-wafer FEOL surface preparation systems are used for photoresist stripping, post etch and pre-diffusion cleans. The Company’s ECD systems are used to plate copper and other metals, which are used for the IC’s internal wiring, or interconnects; to plate solder and lead free solder bumps, and to plate other metals for a range of semiconductor and related applications. In December 2009, Applied Materials, Inc. acquired Semitool, Inc.

Shanghai Hua Hong NEC Electronics Company, Ltd. manufactures semiconductors in Mainland China. It offers IC foundry services. It provides embedded non-volatile memory platforms in various applications, such as microprocessors, communications, consumer products, and smart cards, as well as offers design support, chip manufacturing, and testing services. The company also offers optional capacitors, high resistance poly resistors, and native transistors for designs. In addition, it provides mixed-signal analog CMOS platform that enables integration of less demanding RF circuit blocks with multi-million gate digital CMOS logic functions for wireless, multimedia, and PC products applications. Further, the company offers nvSOC prototype platform, which helps customers to create SOC and ASIC prototype, as well as used in the development of smartcard, MCU, USB Key, and other related products. Furthermore, it provides technology support and services, including various IP, foundry mainstream process design, layout, wafer sort, parametric test, reliability test, and failure analysis, as well as develops various after processes, including embedded non-volatile memories, HVCMOS, and RFCMOS. The company focuses on embedded NVM, LCD driver, analog/power management, RF technology field, and customer electronics.

Shin-Etsu Handotai is one of the world's leading makers of silicon wafers and ingots used in semiconductor manufacturing. Handotai means "semiconductor" in Japanese. It also makes light-emitting element materials -- gallium phosphide, gallium arsenide phosphide, and aluminum gallium indium phosphide -- used in LEDs and other optoelectronic devices. In addition to manufacturing, the company provides engineering and support services. Customers including Intel, Motorola, TSMC, and Texas Instruments use materials produced by Shin-Etsu to make chips for computers, consumer electronics, and telecommunications devices. The company, a part of the ShinEtsu Group, has facilities in Malaysia, Taiwan, the UK, and the US.

SHINKAWA Ltd. company was founded in 1959 and is headquartered in Tokyo, Japan. Shinkawa Ltd. engages in the research, development, design, manufacture, sale, and after-sales service of semiconductor manufacturing equipment in Japan and internationally. Its products include wire bonders, die bonders, COF bonders, bump bonders, flip chip bonders, discrete assemblers, and package sorters.

Founded in 1946, Shinko Electric Industries Co., Ltd. is one of the world's largest manufacturers of integrated circuit (IC) leadframes, ball grid arrays, and other packaging types for semiconductors. As cell phones, portable game players, and other electronic products continue to shrink in size, the packaging of the chips powering the product becomes a crucial aspect of design. Shinko has helped chip makers by steadily shrinking the sizes of its packages, and by coming up with new packaging types such as flip-chips. Shinko Electric Industries Co., Ltd. also provides IC packaging services on a contract basis. Fujitsu owns half of Shinko Electric Industries.

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