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Founded in 1990, Ebara Technologies, Inc. is a part of Ebara Corporation's Precision Machinery Group. Ebara manufactures cleanroom equipment necessary in semiconductor production. Through its two divisions, Components and Semiconductor Equipment, Ebara provides cleaning and ozone, systems, exhaust systems, chemical mechanical polishing systems, wafer plating, heaters, and other equipment used in the electronics industry for silicon wafer processing. It also offers solar exhaust management products. Ebara Technologies has sales offices throughout the US, and sales and production facilities in Asia and Europe.

EG Systems, LLC company's lineup aims to discover flaws and thereby improve the efficiency and output of its customers' wafer fabrication facilities. EG automated probers check semiconductor wafers for defects before the wafers are separated and packaged as individual chips. The company also supplies test handling systems for quality assurance during the final stages of chip production. Software to improve chip production yields is offered, too. More than half of EG's sales are from overseas. Formerly Electroglas, the company filed for Chapter 11 bankruptcy relief in mid 2009 and reemerged in the fall.

Entegris, Inc. was founded in 1966 and is based in Chaska, Minnesota. Entegris, Inc. designs, develops, manufactures, markets, and sells material integrity management products and services in the semiconductor and data storage markets worldwide. It provides a range of products for purifying, protecting, and transporting critical materials used in processing and manufacturing in the semiconductor and other high-technology industries. The company's product portfolio includes contamination control products, such as liquid filtration products, components and systems, and gas filtration products that purify, monitor, and deliver critical liquids and gases to the semiconductor manufacturing process; microenvironment products comprising wafer handling products, wafer shipping products, and data storage products, which preserve the integrity of wafers, reticles, and electronic components at various stages of transport, processing, and storage; and specialty materials products consisting of poco graphite products, specialty coating products, and polymer composites used in semiconductor equipment and low-temperature plasma-enhanced chemical vapor deposition coating of critical components of semiconductor manufacturing equipment used in various stages of the manufacturing process.

EnXnet, Inc. was founded in 1999 and is based in Tulsa, Oklahoma. EnXnet, Inc. engages in the development, marketing, and licensing of technologies for multimedia management products, solutions, and services. It offers DVDPlus, a dual sided hybrid optical disc media that combines two content storage formats for distribution on a single disc, a digital versatile disc (DVD) on one side and a compact disc (CD) on the other. DVDPlus allows content publishers to integrate their visual and audio assets into a single distribution. The company also provides ThinDisc, which is used as stored value cards that combine magnetic stripe and bar code data with optical media in CD and DVD format, or any other optical disc readable products; Disc Security Tag that utilizes electronic article surveillance tags embedded or adhered to a DVD or CD during the injection mold phase of the manufacturing process and provides product item identification to its customers and clients; and EnXcase, which is used in DVDPlus two-sided optical disc media market. In addition, it has a license to compile, use, copy, and modify ClearVideo Source Code for video/audio streaming over the Internet of TV type programming and content. The ClearVideo Technology enhances how video with synchronized audio files are transmitted over narrow and broadband lines; and is used for the compression and transmission of video files for the broadcast industry.

Esec (formerly Oerlikon Assembly Equipment) makes manufacturing equipment used to assemble finished semiconductors. Its core business is making the die bonders, wire bonders, and flip chip bonders needed to lay down the itty bitty pathways on microchips. The company also makes equipment for assembling components and the packaging technology for smart cards. Oerlikon merged the formerly publicly traded ESEC into its Assembly Equipment division in 2004. The company has seven service centers located strategically in select Asian markets, as well as in Europe and the US. In 2009 Oerlikon sold Oerlikon Esec to rival BE Semiconductor Industries in a stock-swap transaction.

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