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SMART Modular Technologies (WWH), Inc. was founded in 1988 and is headquartered in Newark, California. SMART Modular Technologies (WWH), Inc. (SMART), is a designer, manufacturer and supplier of subsystems primarily to original equipment manufacturers (OEMs). The Company’s subsystem products include memory modules, solid state storage products, such as embedded flash and solid state drives (SSDs), embedded computing products, and display products, such as thin film transistor- liquid crystal display (TFT-LCD) products. SMART offers these products to customers worldwide. It also offers custom supply chain services including procurement, logistics, inventory management, temporary warehousing, kitting and packaging services. Its products and services are used for a variety of applications in the computing, networking, communications, printer, storage, defense and industrial markets worldwide. The Company operates in two business segments: the Memory, Display & Embedded Segment and the Adtron Segment.

Standard Microsystems Corporation was founded in 1971 and is headquartered in Hauppauge, New York. Standard Microsystems Corporation (SMSC) designs and sells a variety of silicon-based integrated circuits that are primarily utilizing analog or mixed-signal technologies. Its integrated circuits and systems provide a variety of signal processing attributes that are incorporated by its customers into end products in the consumer electronics and infotainment, the mobile and desktop personal computer, and industrial markets. These products generally provide connectivity, networking or input/output control solutions for a variety of communication, computer and related peripheral, consumer electronics, industrial control system, or automotive information applications. It has four principal product types: computing and connectivity products, analog products, mobile products, and automotive information products. On September 8, 2009, the Company completed the acquisition of Tallika Corporation. In February 2010, the Company acquired Kleer Semiconductor Corporation.

Sumitomo Electric Device Innovations (SEDI; formerly Eudyna Devices) makes compound semiconductors (chips made from chemical compounds other than pure silicon) used in satellite broadcasting gear and other types of wireless communications equipment. The company also manufactures optoelectronic components used in fiber-optic networks. Products include laser diode modules, photodiodes, transponders, and transceivers. SEDI has operations in China, Hong Kong, Italy, Japan, Singapore, the UK, and the US. The company was formed in 2004 from a joint venture between Fujitsu and Sumitomo Electric's electronic devices unit; in 2009 Fujitsu sold its stake in Eudyna, making it a 100% subsidiary of Sumitomo.

Supertex, Inc. was founded in 1975 and is headquartered in Sunnyvale, California. Supertex, Inc. (Supertex) is a producer of high-voltage analog and mixed-signal semiconductor components. The Company designs, develops, manufactures and markets integrated circuits (ICs) utilizing high-voltage diffusion metal oxide semiconductor (DMOS), high-voltage complementary metal oxide semiconductor (HVCMOS) and high-voltage bipolar complementary metal oxide semiconductor (HVBiCMOS) analog, and mixed signal technologies. The Company’s ICs are used in the, medical ultrasound imaging, telecommunications, liquid crystal display (LCD) television, light emitting diodes (LED) general lighting, printer, flat panel display, industrial and consumer industries. The Company’s products are primarily used in or with medical ultrasound instruments, commercial ink jet printers, electro-luminescent (EL) lamps for applications in cell phone keypads and hand-held devices, and optical micro electro-mechanical systems (MEMS) for telecommunication and data communication markets.

Taiwan Semiconductor Manufacturing Company Ltd. was founded in 1987 and is headquartered in Hsinchu, Taiwan. Taiwan Semiconductor Manufacturing Company Limited (TSMC) is principally engaged in the manufacture of integrated circuits (ICs) for customers based on their own or third parties' IC designs. The Company offers a range of wafer fabrication processes, including embedded non-volatile memory process, embedded dynamic random access memory (DRAM) process, mixed signal/ radio frequency (RF) process, high voltage process, complementary metal-oxide semiconductor (CMOS) image sensor process, color filter process, micro electro-mechanical system (MEMS) process and silicon germanium process, among others. The Company's chips are used in computer products, communications products and consumer electronic products. As of December 31, 2008, the Company had seven wafer plants.

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