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Micropac Industries, Inc. company was founded in 1963 and is based in Garland, Texas. Micropac Industries, Inc. manufactures and distributes various types of hybrid microelectronic circuits, solid state relays, power operational amplifiers, and optoelectronic components and assemblies. The Company's products are used as components in a range of military, space and industrial systems, including aircraft instrumentation and navigation systems, power supplies, electronic controls, computers, medical devices, and high-temperature (200 degree centigrade) products. The Company’s products are either custom (being application specific circuits designed and manufactured to meet the particular requirements of a single customer) or standard components, such as catalog items. The Company's products are marketed throughout the United States and in Western Europe, through a direct technical sales staff, independent representatives and independent stocking distributors.

Minco Technology Labs, Inc. was founded in 1981 and is headquartered in Austin, Texas. It has facilities in Tennessee and Texas. Minco Technology Labs, Inc. engages in processing, assembling, and testing semiconductors for medical, military, space, commercial, and telecommunication industries in the United States. It offers radiation hardened products, as well as provides obsolete replacement integrated circuit services and emulation solutions for military and aerospace markets in Europe.

Mindspeed Technologies, Inc. company was founded in 2001 and is headquartered in Newport Beach, California. Mindspeed Technologies, Inc. (Mindspeed) designs, develops and sells semiconductor solutions for communications applications in the wireline and wireless network infrastructure. Its products are classified into three focused product families: multiservice access, high-performance analog and wide area networking communications. Multiservice access products include multi-core digital signal processor (DSP) system-on-a-chip (SoC) products for carrier-class, triple-play edge gateways, metro trunking gateways and other voice over Internet protocol (VoIP) and multi-play service platforms in the carrier infrastructure. The products are used in customer-premises equipment (CPE) gateways and other equipment that carriers are deploying in order to deliver voice, data and video services to residential subscribers. High performance analog products include equalization and signal-conditioning solutions for fiber access networks, including Ethernet passive optical networking (EPON) equipment.

Mirae Corporation is engaged in the manufacture of semiconductor testing equipment parts. The Company operates its business under two segments: assembly test equipment (ATE) and surface mount technology (SMT) segments. Its ATE segment provides test handler products including memory component test handlers, memory module test handlers, burn-in sorter solutions and logic pick and place test handlers. Its SMT segment provides chip mounters and SMT software. During the year ended December 31, 2008, the Company had an annual production capacity of 180 test handlers and its actual production output was 54 test handlers.

MKS Instruments, Inc. was founded in 1961 and is headquartered in Andover, Massachusetts with additional offices in China, France, Germany, Japan, Korea, the Netherlands, Singapore, Taiwan, the United Kingdom, and the United States. MKS Instruments, Inc. (MKS) is a worldwide provider of instruments, subsystems and process control solutions that measure, control, power, monitor and analyze critical parameters to improve process performance and productivity of advanced manufacturing processes. The Company also provides services relating to the maintenance and repair of its products, software maintenance, installation services and training. MKS groups its products into three product groups: Instruments and Control Systems, Power and Reactive Gas Products, and Vacuum Products. MKS’ products are used in diverse markets, applications and processes. The Company’s primary served markets are manufacturers of capital equipment for semiconductor devices and for other thin film applications including flat panel displays, solar cells, data storage media and other advanced coatings.

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