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CEVA, Inc. was founded in 1999 and is headquartered in San Jose, California. CEVA, Inc. (CEVA) is a licensor of silicon intellectual property (SIP) primarily for the handsets, portable multimedia and consumer electronics markets. CEVA licenses a portfolio of digital signal processor (DSP) cores, subsystems and platforms to semiconductor and original equipment manufacturer (OEM) companies worldwide, which include a family of programmable DSP cores; DSP-based subsystems, and a portfolio of application-specific platforms, including video, audio, voice over Internet protocols (VoIP), Bluetooth and Serial Advanced Technology Attachment (SATA). CEVA addresses the requirements of the handsets, portable multimedia and home entertainment markets by designing and licensing programmable DSP cores, DSP-based subsystems, application-specific platforms and a range of software components.

Cirrus Logic, Inc. was founded in 1984 and is headquartered in Austin, Texas. Cirrus Logic, Inc. (Cirrus Logic) develops high-precision, analog and mixed-signal integrated circuits (ICs) for a range of consumer and industrial markets. The Company delivers optimized products for consumer and commercial audio, automotive entertainment and industrial applications. Cirrus also develops ICs, board-level modules and hybrids for high-power amplifier applications branded as the Apex Precision Power line of products. It also provides system reference designs based on its technology that enable the customers to bring products to market in a timely and cost-effective manner. Cirrus serves customers from international sales offices in Europe and Asia, including the People’s Republic of China, Hong Kong, South Korea, Japan, Singapore, Taiwan and the United Kingdom. Cirrus offers approximately 700 products to more than 2,500 end customers worldwide through both direct and indirect sales channels.

DayStar Technologies Inc. company was founded in 1997 and is headquartered in Santa Clara, California. DayStar Technologies, Inc., a development stage company, develops, manufactures, and markets products for the solar photovoltaic industry to convert sunlight into electricity. It offers thin-film copper indium gallium selenide solar products for grid-tied centralized utility markets; and grid-tied decentralized commercial and residential markets.

Energy Conversion Devices, Inc. was founded in 1960 and is headquartered in Rochester Hills, Michigan. Energy Conversion Devices, Inc. (ECD), through its subsidiaries, commercializes materials, products and production processes for the alternative energy generation (primarily solar energy), energy storage and information technology markets. The Company designs, manufactures and sells photovoltaic (PV) products, known as PV or solar laminates that generate renewable energy by converting sunlight into electricity. ECD’s products are particularly suitable for rooftop and building integrated photovoltaic (BIPV) applications, which are its target markets. The Company also receives fees and royalties from licensees of its nickel metal hydride (NiMH) battery technology, and sells nickel hydroxide used in NiMH batteries. ECD has two business segments: United Solar Ovonic and Ovonic Materials. In August 2009, ECD acquired Solar Integrated Technologies Inc. Subsequent to the fiscal year ended June 30, 2009, the Company completed the sale of its interest in Cobasys LLC, its former joint venture.

Entorian Technologies Inc. (Entorian), formerly Staktek Holdings, Inc., is a provider of electronic systems and sub-systems for enterprise, consumer and other markets. The Company's thin, small outline package (TSOP) and ball grid array (BGA) memory stacking solutions seek to increase operational performance by doubling, tripling or quadrupling the amount of memory in the same physical footprint as required by standard packaging technologies. Its ArctiCore technology is a module technology using a double-sided, multi-layer flexible circuit folded around an aluminum core and is designed for thermal, mechanical and electrical performance. The Company's other memory module technologies enable custom, as well as JEDEC-standard registered dual in-line memory module (R-DIMM), fully buffered dual in-line memory module (FB-DIMM) and small outline dual in-line memory modules (SO-DIMMs).

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